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| CHM1291 25-32GHz Single Side Band Mixer GaAs Monolithic Microwave IC Description The CHM1291 is a multifunction chip (MFC) which integrates a LO buffer amplifier and a subharmonically balanced diodes mixer for 2LO suppression and image rejection. It is usable both for up-conversion and down-conversion. It is designed for a wide range of applications, typically commercial communication systems for broadband local access (LMDS). The backside of the chip is both RF and DC grounded. This helps simplify the assembly process. The circuit is manufactured with a P-HEMT process, 0.25m gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is available in chip form. Conv. Loss (dB), LO & 2xLO leakage (dBm) Up-Conversion supradyne mode with external combiner P LO=+5dBm F LO=14GHz 32 28 24 20 16 12 8 4 0 -4 -8 -12 -16 -20 -24 -28 -32 -36 -40 -44 1,5 Main Features Broadband performance : 25-32GHz 11dB conversion Loss 15dBc image rejection +5dBm LO input power +1dBm input power (1dB gain comp.) Low DC power consumption, 55mA@3.5V Chip size : 2.06 x 1.25 x 0.10mm CL sup ( dB ) Img Supp ( dBc ) P 2xLO @ RF ( dBm ) CL inf ( dB ) P LO @ RF ( dBm ) 1,7 1,9 2,1 2,3 2,5 IF Frequency (GHz) Main Characteristics Tamb=+25 C Symbol FRF FLO FIF Lc Parameter RF frequency range LO frequency range IF frequency range Conversion Loss Min 25 12 0.1 Typ Max 32 15.5 3 Unit GHz GHz GHz dB 11 15 ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions ! Ref. : DSCHM12917166 - 15 Jun 07 1/6 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 CHM1291 Tamb=+25 Vd=3.5V, Id=55mA C, Symbol FRF FLO FIF Lc PLO 25-32GHz SSB Mixer Electrical Characteristics for Broadband Operation Parameter RF frequency range LO frequency range IF frequency range Conversion Loss LO Input power Min 25 12 0.1 Typ Max 32 15.5 3 Unit GHz GHz GHz dB dBm 11 +5 -35 13 -2 0 15 0 +2 +8 2.0:1 2.0:1 2.0:1 55 15 2xLO Leak 2xLO Leakage (for PLO=+5dBm) Img Rej P1dB P03 IP3 LO Match RF Match IF Match Id Image Rejection (1) Input power at 1dB gain compression Input power at 3dB gain compression Input 3rd order intercept point LO VSWR (2) RF VSWR (2) IF VSWR (2) Bias current -30 dBm dBc dBm dBm dBm mA (1) With external quadrature hybrid coupler (reference on request). The minimal value depends on the quality of the external quadrature combiner. (2) A bonding wire of typically 0.1 to 0.15nH will improve the accesses matching. Current source biasing network is recommended. Absolute Maximum Ratings Tamb=+25 (1) C Symbol Vd Id Ta Tstg Drain bias current Operating temperature range Storage temperature range Parameter Drain bias voltage Values 4.0 100 -40 to +85 -55 to +155 Unit V mA C C (1) Operation of this device above anyone of these parameters may cause permanent damage. (2) Duration < 1s. Ref. : DSCHM12917166 - 15 Jun 07 2/6 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 25-32GHz SSB Mixer CHM1291 Typical On-wafer Measurements in Up-Conversion mode with external IF quadrature combiner Bias conditions: Tamb=+25 Vd=3.5V, Id=55mA C, Up-Conversion supradyne mode with external combiner P LO=+5dBm F LO=14GHz 32 28 24 20 16 12 8 4 0 -4 -8 -12 -16 -20 -24 -28 -32 -36 -40 -44 1,5 Conv. Loss (dB), LO & 2xLO leakage (dBm) Conv. Loss (dB), LO & 2xLO leakage (dBm) Up-Conversion infradyne mode with external combiner P LO=+5dBm F LO=14GHz 32 28 24 20 16 12 8 4 0 -4 -8 -12 -16 -20 -24 -28 -32 -36 -40 -44 1,5 CL sup ( dB ) Img Supp ( dBc ) P 2xLO @ RF ( dBm ) CL inf ( dB ) P LO @ RF ( dBm ) CL sup ( dB ) Img Supp ( dBc ) P 2xLO @ RF ( dBm ) CL inf ( dB ) P LO @ RF ( dBm ) 1,7 1,9 2,1 2,3 2,5 1,7 1,9 2,1 2,3 2,5 IF Frequency (GHz) IF Frequency (GHz) Conv. Loss (dB), LO & 2xLO leakage (dBm) 30 26 22 18 14 10 6 2 -2 -6 -10 -14 -18 -22 -26 -30 -34 -38 -42 -46 -50 -54 12 12,5 Conv. Loss (dB), LO & 2xLO leakage (dBm) Up-Conversion supradyne mode with external combiner P LO=+5dBm F IF=2,0GHz Up-Conversion infradyne mode with external combiner P LO=+5dBm F IF=2,0GHz 30 26 22 18 14 10 6 2 -2 -6 -10 -14 -18 -22 -26 -30 -34 -38 -42 -46 -50 -54 12 12,5 CL sup ( dB ) Img Supp (dBc) P 2xLO @ RF ( dBm ) CL inf ( dB ) P LO @ RF ( dBm ) CL sup ( dB ) Img Supp (dBc) P 2xLO @ RF ( dBm ) CL inf ( dB ) P LO @ RF ( dBm ) 13 13,5 14 14,5 LO Frequency (GHz) 15 15,5 16 13 13,5 14 14,5 LO Frequency (GHz) 15 15,5 16 Typical On-wafer Compression Measurements in Up-Conversion mode with external IF quadrature combiner Bias conditions: Tamb=+25 Vd=3.5V, Id=55mA C, Up-Conversion supradyne mode with external combiner LO=14GHz P LO=+5dBm F IF=2,0GHz (RF=30GHz) -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 -22 -24 -26 -28 -30 -20 -18 -16 -14 -12 Up-Conversion infradyne mode with external combiner LO=14GHz P LO=+5dBm F IF=2,0GHz (RF=26GHz) -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 -22 -24 -26 -28 -30 -20 -18 -16 -14 -12 Output power & Conv. Loss (dBm & dB) P RF 30GHz CL 30GHz Output power & Conv. Loss (dBm & dB) P RF 26GHz CG 26GHz -10 -8 -6 -4 -2 0 2 4 6 -10 -8 -6 -4 -2 0 2 4 6 IF Input power (dBm) IF Input power (dBm) Ref. : DSCHM12917166 - 15 Jun 07 3/6 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 CHM1291 Bias conditions: Tamb=+25 Vd=3.5V, Id=55mA C, Down-Conversion mode with external combiner P LO=+5dBm F LO=12GHz -6 -8 -10 -12 -6 -8 -10 -12 25-32GHz SSB Mixer Typical On-wafer Measurements in Down-Conversion mode with external IF quadrature combiner Down-Conversion mode with external combiner P LO=+5dBm F LO=14GHz Conversion Loss (dB) -14 -16 -18 -20 -22 -24 -26 -28 -30 -32 -34 21,5 22,0 22,5 23,0 23,5 24,0 24,5 25,0 25,5 26,0 26,5 Conversion Loss (dB) -14 -16 -18 -20 -22 -24 -26 -28 -30 -32 -34 25,5 26,0 26,5 27,0 27,5 28,0 28,5 29,0 29,5 30,0 30,5 CL I Sup ( dB ) CL Q Sup ( dB ) F LO CL I Inf ( dB ) CL Q Inf ( dB ) CL I Sup ( dB ) CL Q Sup ( dB ) F LO CL I Inf ( dB ) CL Q Inf ( dB ) RF Frequency (GHz) RF Frequency (GHz) Conv. Loss (dB), LO & 2xLO leakage (dBm) Down-Conversion mode with external combiner P LO=+5dBm F LO=16GHz -6 -8 -10 -12 Down-Conversion mode with external combiner P LO=+5dBm F IF=2,0GHz -6 -10 -14 -18 -22 -26 -30 -34 -38 -42 -46 -50 -54 12 12,5 13 13,5 14 14,5 LO Frequency (GHz) 15 15,5 16 CL I Sup ( dB ) CL Q Sup ( dB ) P LO @ RF ( dBm ) CL I Inf ( dB ) CL Q Inf ( dB ) P 2xLO ( dBm ) Conversion Loss (dB) -14 -16 -18 -20 -22 -24 -26 -28 -30 -32 -34 29,5 30,0 30,5 31,0 31,5 32,0 32,5 33,0 33,5 34,0 34,5 CL I Sup ( dB ) CL Q Sup ( dB ) F LO CL I Inf ( dB ) CL Q Inf ( dB ) RF Frequency (GHz) Typical On-wafer Measurements in Down-Conversion mode without external IF quadrature combiner Bias conditions: Tamb=+25 Vd=3.5V, Id=55mA C, Down-Conversion supradyne mode without external combiner F LO=13GHz P LO=+5dBm F RF=26 to 33GHz -10 -14 -18 Down-Conversion infradyne mode without external combiner F LO=15GHz P LO=+5dBm F RF=23 to 29GHz -10 -14 -18 Conv. Loss (dB) LO & 2LO leakage (dBm) -22 -26 -30 -34 -38 -42 -46 -50 -54 -58 0 1 2 3 4 5 6 7 Conv. Loss (dB) LO & 2LO leakage (dBm) -22 -26 -30 -34 -38 -42 -46 -50 -54 -58 0 1 2 3 4 5 6 7 CL I Sup ( dB ) P LO @ IF ( dBm ) CL Q Sup ( dB ) P 2XLO @ IF ( dBm ) CL I Inf ( dB ) P LO @ IF ( dBm ) CL Q Inf ( dB ) P 2XLO @ IF ( dBm ) IF Frequency (GHz) IF Frequency (GHz) Ref. : DSCHM12917166 - 15 Jun 07 4/6 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 25-32GHz SSB Mixer Chip Assembly and Mechanical Data CHM1291 Note : Supply feed should be capacitively bypassed. 25m diameter gold wire is recommended Bonding pad positions ( Chip thickness : 100m. All dimensions are in micrometers ) Ref. DSCHM12917166 - 15 Jun 07 5/6 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 CHM1291 25-32GHz SSB Mixer Ordering Information Chip form : CHM1291-99F/00 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHM12917166 - 15 Jun 07 6/6 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 |
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